MCIMX6S5EVM10AB

MCIMX6S5EVM10AB

IC MPU I.MX6S 1.0GHZ 624MAPBGA IC CHIP CO., LIMITED Global electronics supply chain services experts As one of the largest independent distributors of electronic components mixed provider, headquartered in Shenzhen 1.Product Overview Documents & Media 3. product pictures 4.Professional QC...

Product Details

IC MPU I.MX6S 1.0GHZ 624MAPBGA

 

Product Attributes

 

Categories

Integrated   Circuits (ICs)

Embedded   - Microprocessors

Manufacturer

NXP USA Inc.

Series

i.MX6S

Packaging 

Tray 

Part Status

Not For New Designs

Core Processor

ARM® Cortex®-A9

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

1.0GHz

Co-Processors/DSP

Multimedia; NEONTM SIMD

RAM Controllers

LPDDR2, LVDDR3, DDR3

Graphics Acceleration

Yes

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100/1000 Mbps (1)

SATA

-

USB

USB 2.0 + PHY (4)

Voltage - I/O

1.8V, 2.5V, 2.8V, 3.3V

Operating Temperature

-20°C ~ 105°C (TJ)

Security Features

ARM TZ, Boot Security, Cryptography,   RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper   Detection

Package / Case

624-LFBGA

Supplier Device Package

624-MAPBGA (21x21)

Additional Interfaces

CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI,   SSI, UART


 

Email: Aliza@buyicchip.com


 

 

Wind-erosion landform refers to the surface morphology formed by wind erosion and abrasion of surface material. A number of windy cities have been formed in the 13 rooms of eastern xinjiang and the tertiary stratum in the south of hami. In arid regions, by the wind erosion and sand on the ground substance and formed by the abrasive action of wind erosion landform, often have a wide range of distribution in the wind, especially is more typical of tuyere windward area development.

 

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