EP3C25F256C8N

EP3C25F256C8N

IC FPGA 156 I/O 256FBGA IC CHIP CO., LIMITED here, 16 years experience of exporting electronic components.We are specializes in supplying qualified IC components for international top electronics company. Our mainly cooperation brand contains...

Product Details

IC FPGA 156 I/O 256FBGA

 


Product Attributes

 

Categories

Integrated   Circuits (ICs)

Embedded   - FPGAs (Field Programmable Gate Array)

Manufacturer

Altera

Series

Cyclone® III

Part Status

Active

Number of LABs/CLBs

1539

Number of Logic Elements/Cells

24624

Total RAM Bits

608256

Number of I/O

156

Voltage - Supply

1.15 V ~ 1.25 V

Mounting Type

Surface Mount

Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

256-LBGA

Supplier Device Package

256-FBGA (17x17)


 

Email: sales@theicchip.com 


Only when the terminal side supports the powerful computing performance and the rich content of the cloud, the rendering task is distributed in the cloud and the terminal, so as to bring a more realistic VR experience in the mobile environment. At present, qualcomm and Microsoft are developing VR/AR chips that enhance the visual quality, rendering capabilities and tracking capabilities to enhance the VR terminal resolution. And the commercial popularization of 5G is the most promising solution to reduce the delay of terminal and cloud transmission. Huawei network experts told reporters that the requirement of the network is related to the specific business type of VR, and 5G bandwidth can support the VR business of 16K.

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