Integrated circuit (IC) is a new type of semiconductor device developed in the the early 1960s. It is oxidized, lithography, diffusion, epitaxy, aluminum and other semiconductor manufacturing processes, the formation of a certain function of the circuit required by the semiconductor, resistance, capacitance and other components and their connecting wire are all integrated in a small piece of silicon, and then welding encapsulated in a shell of electronic devices. The package shell has a round shell type, flat type or double row direct inserting type and so on many forms.
Integrated circuits or micro-circuits, microchips, and chips in electronics are a way of miniaturization of circuits (mainly semiconductor devices, including passive components, etc.) and are usually made on the surface of a semiconductor wafer.
The integrated circuit, which is manufactured on the surface of a semiconductor chip, is also called a thin-film IC. Another kind of thick-film hybrid integrated circuit is a miniaturized one composed of an independent semiconductor device and a passive component, integrated into a substrate or a circuit board.
This article is about monolithic integrated circuit, namely thin film integrated circuit.
The integrated circuit has the advantages of small size, light weight, less lead line and welding point, long life, high reliability, good performance, and low cost, convenient for mass production. It not only in the work, civilian electronic equipment such as tape recorder, television, computer and other aspects have been widely used, at the same time in the military, communications, remote control has been widely used. Using integrated circuit to assemble electronic equipment, its assembly density can be increased dozens of times times to thousands of times times than transistor, and the stable working time of equipment can be greatly improved.