xilinx introduction

- Mar 02, 2018-

Xilinx Solutions Enable Smarter Systems through the industry’s broadest lineup of All Programmable FPGAs, 3D ICs and SoCs that set the standard for low cost, highest performance, and lowest power.

The Xilinx UltraScale™ architecture delivers unprecedented levels of integration and capability while delivering ASIC-class system level performance for the most demanding applications requiring massive I/O & memory bandwidth, massive data flow, DSP, and packet processing performance. Our break-out portfolio also includes the industry’s only programmable homogeneous and heterogeneous 3D ICs with the highest bandwidth and system integration. In addition, our hardware, software and I/O programmable SoC platform offers the flexibility and scalability of an FPGA combined with ASIC-like performance and power and the ease of use of an ASSP. Learn more about how Xilinx is delivering a generation ahead at 28nm and staying a generation ahead at 16nm.

Xilinx All Programmable 3D ICs utilize stacked silicon interconnect (SSI) technology to break through the limitations of Moore’s law and deliver the capabilities to satisfy the most demanding design requirements. Xilinx homogeneous and heterogeneous 3D ICs deliver the highest logic density, bandwidth, and on-chip resources in the industry, breaking new ground in system-level integration.

Xilinx UltraScale™ 3D ICs provide unprecedented levels of system integration, performance, bandwidth, and capability. Both Virtex® UltraScale 3D ICs and Kintex®UltraScale 3D ICs contain a step-function increase in both the amount of connectivity resources and the associated inter-die bandwidth in this second-generation 3D IC architecture. The big increase in routing and bandwidth and the new 3D IC wide memory optimized interface ensures that next-generation applications can achieve their target performance at extreme levels of utilization. Virtex UltraScale+ 3D ICs include all of the architectural innovations delivered with the UltraScale families and incorporate 16nm 3D transistors for a “3D-on-3D” step function increase in performance per watt, with optional HBM Gen2 memory.

Xilinx offers 19 3D IC devices in Virtex UltraScale+, Virtex UltraScale, Kintex UltraScale, and Virtex-7 families– thereby offering customers a broad range of resources and capabilities to match leading edge demands. The SSI devices shown below offer unprecedented FPGA capabilities and are ideal for applications such as next-generation wired communications, high-performance computing, medical image processing, and ASIC prototyping/emulation.