LM2674MX-3.3/NOPB IC REG BUCK 3.3V 0.5A 8SOIC
|Packaging||Tape & Reel (TR)|
|Number of Outputs||1|
|Voltage - Input (Min)||6.5V|
|Voltage - Input (Max)||40V|
|Voltage - Output (Min/Fixed)||3.3V|
|Voltage - Output (Max)||-|
|Current - Output||500mA|
|Frequency - Switching||260kHz|
|Operating Temperature||-40°C ~ 125°C (TJ)|
|Mounting Type||Surface Mount|
|Package / Case||8-SOIC (0.154", 3.90mm Width)|
|Supplier Device Package||8-SOIC|
|Base Part Number||LM2674|
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IC CHIP CO., LIMITED
Through the redesign of the raw material purification system, the raw material end is completely removed and controlled impurities. The team systematically solved the problem of impurities release by choosing semiconductor grade materials and manufacturing comprehensive cleaning equipment, and the world first initiated automatic non-contact silicon processing system.The price of silicon wafers, one of the key materials in the semiconductor industry, is rising, and the trend is spreading rapidly from 12 inches to 8 inches and 6 inches. Otherwise, TSMC and umc foundry enterprises has with Japan letter (ShinEtsu), earn more silicon wafer, such as the main suppliers to sign 1 ~ 2 years short medium-term contracts, including 12-inch wafers contract price has been increased to $120 per piece, compared with $75 at the end of last year rose 60%.