IHLP4040DZER1R8M11 FIXED IND 1.8UH 17A 5 MOHM SMD
|Packaging||Tape & Reel (TR)|
|Material - Core||-|
|Current - Saturation||16A|
|DC Resistance (DCR)||5 mOhm Max|
|Q @ Freq||-|
|Operating Temperature||-55°C ~ 125°C|
|Frequency - Test||100kHz|
|Mounting Type||Surface Mount|
|Package / Case||Nonstandard|
|Supplier Device Package||-|
|Size / Dimension||0.430" L x 0.406" W (10.92mm x 10.30mm)|
|Height - Seated (Max)||0.157" (4.00mm)|
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IC CHIP CO., LIMITED
Manufacturers are confident that the market for 3D sensing will explode in late 2018 and early 2019. Shen Xuan think short-term cost is high, the yield can lead to problems such as 3 d structure light is only applicable in 2018 at the high end of the roof with main chip products, for example, at the same time, he also believes that erupted in 2019, with the fingerprint and double perturbation technology import to the smartphone, become the standard of the products.